Qualcomm Snapdragon 662 vs Qualcomm Snapdragon 6s 4G Gen 1

Qualcomm Snapdragon 662

The Qualcomm Snapdragon 662 is a lower mid-range ARM-based SoC largely found in Android tablets and smartphones. It features 8 Kryo 260 cores (custom design, 64-Bit capable) that are divided in two clusters. A fast cluster of four cores with up to 2 GHz (Kryo 260 Gold - Cortex-A73 derivate) and a power saving efficiency cluster with up to 1.8 GHz (Kryo 260 Silver - Cortex A53 derivate). Both clusters can also be used together.

In addition to the 8 CPU cores, the SoC integrates a mid range Adreno 610 GPU with a LPDDR4 memory controller (dual-channel)  and supports Wi-Fi (802.11ac + MIMO, max. 867 Mbps), Bluetooth 5, and LTE (X12 LTE modem with up to 600 Mbps download and 150 Mbps upload).

Power Consumption

Thanks to the new 11 nm LPP process, the energy efficiency should be quite good.

Qualcomm Snapdragon 6s 4G Gen 1

The Qualcomm Snapdragon 6s 4G Gen 1 is a renamed Snapdragon 662 SoC of the lower mid-range for (Android based) smartphones and tablets. The processor unit contains 8 Kryo-260 CPU cores (4x ARM Cortex-A73 with up to 2.1 GHz and 4x ARM Cortex-A53 with up to 1.8 GHz). The Qualcomm Adreno 610 is used as the graphics unit

The SoC comes with the third generation of Qualcomm's AI Engine and also includes Bluetooth 5.1. It is interesting to note that Qualcomm describes the Wi-Fi capability as "WiFi-6-ready", meaning you can connect to a WiFi 6 network, but not all parts of the standard are supported. The new WPS3 security protocol can be used. Support for the HEIF image file format and the Indian satellite network NavIC are also new.

The performance should be very similar to the old Snapdragon 662 (see for benchmarks).

The Snapdragon X11 is integrated as an LTE modem, which supports LTE Cat.13 in the uplink and downlink, as well as 2x2 MIMO in the downlink. The maximum transmission speed is 390 MBit/s (download) and 150 MBit/s (upload).

In terms of mass storage, a maximum of UFS 2.1 is supported, the memory limits are 32 GB and LP4x.

The SoC is manufactured using the 11 nm process.